96 MPO • Company Capabilities
Micro Systems Technologies Management AG (MST)
(headquarters)
Neuhofstrasse 4
CH-6340 Baar / Switzerland
Phone: + 41 ( 44) 804 6300
Fax: + 41 ( 44) 804 6301
E-mail: info@mst.com
Web : www.mst.com
Micro Systems Technologies, Inc. (US sales office)
1839 S. Alma School Road, Suite 270
Mesa, AZ 85210-3024 / USA
Phone: +1 (480) 775 6878
Fax: +1 (480) 398 1495
WHO WE ARE
The Micro Systems Technologies group consists of four technology
companies with more than 1000 employees in three countries:
• DYCONEX AG, Switzerland
High-end PCBs, LCP and chip-packaging substrates
• LITRONIK Batterietechnologie GmbH, Germany
Batteries and hermetic feedthroughs for medtech implants
• Micro Systems Engineering GmbH, Germany
LTCC substrates, advanced assembly and semiconductor
packaging
• Micro Systems Engineering, Inc., USA
Development and manufacturing of electronic modules,
SMD assembly
As a group we offer innovative solutions from concept to series
production in the field of medical microelectronics including
development & design, system integration and manufacturing,
as well as batteries, battery packs and hermetic feedthroughs
for active implants.
MAJOR MARKETS
Active around the globe the MST group provides innovative
products and services for medical devices, especially active
implants, and other high-reliability/high-performance industries.
SERVICES OFFERED
PCBs, LCP and chip-packaging substrates
Ultra-high-density interconnect (Ultra-HDI)/microvia printed
circuit boards in flex, rigid-flex and rigid technology, LCP
substrates and chip-packaging substrates are provided for every
application where miniaturization, high performance, high
frequencies and reliability play a role.
LTCC (Low Temperature Co-fired Ceramic) substrates
This multilayer ceramic technology provides complex substrate
solutions with a variety of beneficial features like fine line
resolution and integrated passive components for avionic,
space, radar, automotive or sensor applications
Advanced assembly
Extensive assembly equipment and inspection technologies in the
field of SMT (Surface Mount Technology) and chip & wire enable
us to assemble an extremely wide range of components like SMD
(Surface Mount Devices), BGA (Ball Grid Arrays), CSP (Chip
Scale Packages), flip chips and bare dies on any board material
for the production of complex, miniaturized electronic modules.
Semiconductor packaging
Various customized packaging solutions for a wide range of
base materials, I/O configurations and housing types. The
newest technology development enables the production of
SDBGAs (Stacked Die Ball Grid Arrays) using transfer molding
technology in small and medium-sized volumes.
Primary batteries
High-performance energy sources using electrochemical
systems based on lithium-iodine and lithium-manganese dioxide
for active medtech implants like pacemakers, defibrillators or
neurostimulators.
Hermetic feedthroughs
Ceramic-to-metal, glass-to-metal or glass/ceramic-to-metal feedthroughs for hermetically sealed interfaces in active medical
implants, implantable batteries and sensors.
www.mst.com
